JPH0528772Y2 - - Google Patents
Info
- Publication number
- JPH0528772Y2 JPH0528772Y2 JP2528887U JP2528887U JPH0528772Y2 JP H0528772 Y2 JPH0528772 Y2 JP H0528772Y2 JP 2528887 U JP2528887 U JP 2528887U JP 2528887 U JP2528887 U JP 2528887U JP H0528772 Y2 JPH0528772 Y2 JP H0528772Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- holding jig
- sheet holding
- outer ring
- wafer sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Special Conveying (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2528887U JPH0528772Y2 (en]) | 1987-02-23 | 1987-02-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2528887U JPH0528772Y2 (en]) | 1987-02-23 | 1987-02-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63134546U JPS63134546U (en]) | 1988-09-02 |
JPH0528772Y2 true JPH0528772Y2 (en]) | 1993-07-23 |
Family
ID=30825301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2528887U Expired - Lifetime JPH0528772Y2 (en]) | 1987-02-23 | 1987-02-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0528772Y2 (en]) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012059749A (ja) * | 2010-09-06 | 2012-03-22 | Shin Etsu Polymer Co Ltd | 基板用の保持治具 |
JP7237413B2 (ja) * | 2018-05-14 | 2023-03-13 | 株式会社ディスコ | ウェーハの加工方法 |
JP2019212813A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2019212815A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2019212814A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2020024991A (ja) * | 2018-08-06 | 2020-02-13 | 株式会社ディスコ | ウェーハの加工方法 |
JP2020024990A (ja) * | 2018-08-06 | 2020-02-13 | 株式会社ディスコ | ウェーハの加工方法 |
JP7166722B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
JP7166721B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
JP7166723B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
-
1987
- 1987-02-23 JP JP2528887U patent/JPH0528772Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63134546U (en]) | 1988-09-02 |
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